Description

• Suitable for Flip-Chip packaging process substrates.
• Made of high-quality stainless steel.
• Offers multiple processing methods, e.g., stamping, wire cutting, CNC machining.
• Pins undergo special reinforcement treatment to reduce damage risk.
• Highly durable, pins remain secure during use.
• Flatness controlled within ≤0.20 mm.
• Dimensional tolerance accuracy within ≤0.05 mm.