300mm FOUP(Full ESD)
Description
- Provides high-efficiency protection for 300mm wafers during transportation and storage.
- Excellent air tightness and inflation function can maintain a clean environment inside the FOUP to reduce risk of contamination.
- Customized modifications can also be made according to the equipment parameter settings to ensure the compatibility of the FOUP and equipment.
Specification
- Dimension:L350.5 * W412 * H337mm
- Substrate:300mm wafer
- Capability:13pcs & 25pcs