Description

• FOUP specialized for thin wafer processing
• FOUP chamber is made of electrostatic dissipative material through integrated injection molding, ensuring uniform electrostatic dissipation and excellent rigidity
• Compatible with various fork shapes available on the market
• Warpage < 10mm
• Wafer thickness: 0.1~0.3mm
  
  

Specification

• Size：12 inch wafer
• Capacity：13pcs
• Pitch：20mm