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Suting Precision Industry Co., Ltd. - Heat Spreader,Wafer & Substrate Carrier,Precision Stamping,Heat Spreader,SEMI Solution

Film Frame FOUP

Description

  • FOUP specialized for advanced packaging processes such as CoWos, SoIC, and HBM
  • Integrated design to hold film frames used in dicing and grinding stages
  • Compatible with automated transportation systems such as load ports, EFEM, and AMHS
  • Equipped with a gas purging function

Specification

  • Size:12 inch film frame
  • Capacity:13pcs
  • Pitch:10mm
  • Weight:<4kg
Film Frame FOUP
Film Frame FOUP