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Suting Precision Industry Co., Ltd. - Heat Spreader,Wafer & Substrate Carrier,Precision Stamping,Heat Spreader,SEMI Solution

Panel FOUP

Description

  • Provides high-efficiency protection for Panel/ABF/Glass during transportation and storage, and maintains a clean environment inside the FOUP. 
  • Suting also provid customization for substrate size and capcacity to carry customer's product.
  • Equipped with a gas purging function.

Specification

  • Dimension:L600 * W620 * H438mm
  • Substrate:panel 510*515mm, 600*600mm, 515*620mm
  • Capability:6pcs, 12pcs(standard), 16pcs(customized)
  • Pitch:50mm/6slot, 25mm/12slot
  • Weight:≦25kg
Panel FOUP
Panel FOUP